Electronics

The electronics content in modern Automobiles has increased substantially in recent years. Now, sophisticated electronic systems of many different types are standard equipment. Life span and reliability of these systems and their interconnects remains a major concern especially with the thermal and mechanical loads increasing as the electronic module sizes decrease. A failure in even one of the over 2000 crimp joints or 50000 solder joints in a typical car can result in degradations of safety, quality, and consumer satisfaction and can significantly increase warranty cost exposure.

The Abaqus Unified FEA product suite from SIMULIA are heavily used in the Automotive Electronics industry to supplement and replace physical testing as well as to help design the electronics systems themselves to meet higher standards of performance and reliability.

Solution Capabilities

• Industry leading capabilities for modeling solder joints and other interconnects and their materials
• Extensive library of material constitutive models for common electronic material including leaded and lead-free solder, boards, silicon, ceramics, and other materials
• Advanced capability for simulating aging in these materials
• Unique technology for determining strain cycles during transient load without simulating each load cycle