Abaqus Multiphysics / Thermal-Mechanical / Thermal-Mechanical Example
Thermal Creep Analysis of Lead-free Solder
Challenge
The electronics industry is working towards reducing the amount of lead in end-user equipment, and legislation requires the eventual use of lead-free materials. While the long-term reliability of leaded solder is well understood after its 50 years of use, the same is not true for lead-free solder. The transition to these new alloys requires the development of new analytical capabilities for estimating the reliability of components that use lead-free solder.
Solution
The Multiphysics solution from SIMULIA allows manufacturers to analyze lead-free electronic components undergoing thermal fatigue. Advanced material modeling and calibration tools are available for all materials commonly found in electronics components and assemblies, including leaded and lead-free solder.
Benefit
Accurate results are obtained from special purpose simulation procedures that provide best-in-class performance of cyclic loading for lifecycle prediction.
Thirty-six solder balls connect the silicon die and the substrate, with underfill material used in the space surrounding the solder balls. All components except the substrate are encapsulated in the mold.
Schematic section view of the BGA model
The animation shows the development of Mises stress in the BGA over 4 thermal cycles. The stresses during thermal cycling are caused by the mismatch in thermal expansion coefficients between the materials making up the electronic package. The advanced material models available in ABAQUS accurately capture the creep response of the solder joints during the cyclic loading phase; these results can then be used in subsequent lifecycle predictions.
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