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Electrical Heating of Electronic Packages

Challenge

Thermal design of electronic components and packages must include the effect of heating due to current flow.

Solution

The Mutiphysics solution from SIMULIA allows electronics manufacturers to analyze the coupled thermal-electrical fields and further to use the thermal solution to drive a coupled mechanical analysis. Tools are available to simply and efficiently build complex electronics assemblies from Electrical-CAD data

Benefit

Accurate simulation taking into account coupled-thermal, electrical, and mechanical fields is key to electronic component and package design. Virtual package design and qualification offers significant time savings over physical testing.

An example of an electrical heating problem taken from an automobile audio system.

Analysis temperature predictions agree extremely well with physical test results. A design change introducing heat sinks on the diode legs was qualified virtually before being tested as the appropriate solution to this problem.

 

 

 

 
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