Residual Stress induced in the Replication Process of Microscreen-based Electroforming Micormolds by Resin Transfer Molding

Yang Jing
University of Connecticut, USA

During resin transfer molding process for the replication of microscreen-based electroforming molds, the development of residual stress can result in the deformation of thermoset composite structures. It is desired to predict residual stress and deformation in the resin transfer molding process to improve the dimensional accuracy for manufacturing thermoset composite structures. A thermo-chemo-viscoelastic model is developed to simulate the heat transfer and curing for the resin transfer molding process, the residual stress and deformation induced in the process was investigated in this paper. The effect of various process parameters, such as cure temperature, cooling rate, geometry, and porosity of porous foam, on the residual stress and deformation was presented. Three types of mold geometry were considered in this study, and design windows for these types of geometries were also suggested for choosing process parameters of resin transfer molding process to minimize the residual stress and deformation.