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Transient Analysis - Drop Impact of Printed Circuit Board Assembly
Dhananjay Panchagade
Auburn University, USA
Drop-induced failures are most dominant in portable electronic products. In this study, explicit finite element models have been used to study the transient dynamics of printed circuit boards during drop from 6ft. Model predictions have been validated with experimental data. Ultra high-speed video has been used to capture the deformation kinematics of PCB assembly. Component types examined include – plastic ball-grid arrays, tape-array BGA, QFN, and C2BGA.
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